Infineon Technologies IRF6644TRPBF
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| Attribute | Value |
|---|---|
| HTS | COMPONENTS |
| PPAP | No |
| EU RoHS | Compliant |
| Category | Power MOSFET |
| Material | Si |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 7 |
| Automotive | No |
| Lead Shape | No Lead |
| PCB changed | 7 |
| Availability | In Stock (cut strips) |
| Channel Mode | Enhancement |
| Channel Type | N |
| Configuration | Single Quad Drain Dual Source |
| Package Width | 5.05(Max) |
| Package Height | 0.53(Max) |
| Package Length | 5.45(Max) |
| Supplier Package | Direct-FET MN |
| Manufacturer Lead Time | 18 weeks |
| Typical Fall Time (ns) | 16 |
| Typical Rise Time (ns) | 26 |
| Number of Elements per Chip | 1 |
| Maximum Power Dissipation (mW) | 2800 |
| Typical Gate Charge @ 10V (nC) | 35 |
| Typical Gate Charge @ Vgs (nC) | 35@10V |
| Maximum Gate-Source Voltage (V) | ±20 |
| Typical Turn-On Delay Time (ns) | 17 |
| Maximum Drain-Source Voltage (V) | 100 |
| Typical Turn-Off Delay Time (ns) | 34 |
| Maximum Operating Temperature (°C) | 150 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Continuous Drain Current (A) | 10.3 |
| Typical Input Capacitance @ Vds (pF) | 2210@25V |
| Maximum Drain-Source Resistance (mOhm) | 13@10V |
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Packaging Process
