Infineon Technologies IRF6613TRPBF
Image is only for reference
| Attribute | Value |
|---|---|
| HTS | 8541.29.00.55 |
| PPAP | No |
| EU RoHS | Compliant |
| Category | Power MOSFET |
| Material | Si |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 7 |
| Automotive | No |
| Lead Shape | No Lead |
| PCB changed | 7 |
| Availability | In Stock (cut strips) |
| Channel Mode | Enhancement |
| Channel Type | N |
| Configuration | Single Quad Drain Dual Source |
| Package Width | 5.05(Max) |
| Package Height | 0.53(Max) |
| Package Length | 5.45(Max) |
| Supplier Package | Direct-FET MT |
| Manufacturer Lead Time | 16 weeks |
| Typical Fall Time (ns) | 4.9 |
| Typical Rise Time (ns) | 47 |
| Number of Elements per Chip | 1 |
| Maximum Power Dissipation (mW) | 2800 |
| Typical Gate Charge @ Vgs (nC) | [email protected] |
| Maximum Gate-Source Voltage (V) | ±20 |
| Typical Turn-On Delay Time (ns) | 18 |
| Maximum Drain-Source Voltage (V) | 40 |
| Typical Turn-Off Delay Time (ns) | 27 |
| Maximum Operating Temperature (°C) | 150 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Continuous Drain Current (A) | 23 |
| Typical Input Capacitance @ Vds (pF) | 5950@15V |
| Maximum Drain-Source Resistance (mOhm) | 3.4@10V |
| Typical Drain-Source Resistance @ 25°C (mOhm) | 2.6@10V|[email protected] |
Purchase & Inquiry
You can place an order with FIXCHIPS without having to register or create an account.
To make payment more convenient, we support multiple payment methods in USD, including PayPal, credit cards, and wire transfer.
We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.
1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.
2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.
Packaging Process
