10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Infineon Technologies BGS12P2L6E6327XTSA1

Infineon Technologies BGS12P2L6E6327XTSA1 electronic component product image

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Manufacturer No
BGS12P2L6E6327XTSA1
Date Code
25+
Quantity
2,000
Availability
In Stock
Package
6-XFDFN
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
IC RF SWITCH SPDT 6GHZ TSLP6-4
Detailed Description
RF Switch IC GSM, LTE, W-CDMA SPDT 50Ohm PG-TSLP-6-4
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
IIP3
74dBm
P1dB
-
Grade
-
Series
-
Circuit
SPDT
RF Type
GSM, LTE, W-CDMA
Features
-
Topology
-
Impedance
50Ohm
Isolation
27dB
Packaging
Tape & Reel (TR); Cut Tape (CT)
Manufacturer
Infineon Technologies
Mounting Type
Surface Mount
Qualification
-
Insertion Loss
0.51dB
Package / Case
6-XFDFN
Test Frequency
5.925GHz
Frequency Range
50MHz ~ 6GHz
Voltage - Supply
1.65V ~ 3.4V
Base Product Number
BGS12P2
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
PG-TSLP-6-4
AttributeValue
IIP374dBm
P1dB-
Grade-
Series-
CircuitSPDT
RF TypeGSM, LTE, W-CDMA
Features-
Topology-
Impedance50Ohm
Isolation27dB
PackagingTape & Reel (TR); Cut Tape (CT)
ManufacturerInfineon Technologies
Mounting TypeSurface Mount
Qualification-
Insertion Loss0.51dB
Package / Case6-XFDFN
Test Frequency5.925GHz
Frequency Range50MHz ~ 6GHz
Voltage - Supply1.65V ~ 3.4V
Base Product NumberBGS12P2
Operating Temperature-40°C ~ 85°C (TA)
Supplier Device PackagePG-TSLP-6-4

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Packaging Process