Infineon Technologies BGA825L6SE6327XTSA1

Infineon Technologies BGA825L6SE6327XTSA1 electronic component product image

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Manufacturer No
BGA825L6SE6327XTSA1
Package
6-XFDFN
Packaging
Tape & Reel (TR)
Description
IC AMP GPS 1.55-1.615GHZ TSLP6-3
Detailed Description
RF Amplifier IC GPS 1.55GHz ~ 1.615GHz TSLP-6-3
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Gain
17dB
P1dB
-10dBm
Series
-
RF Type
GPS
Frequency
1.55GHz ~ 1.615GHz
Packaging
Tape & Reel (TR)
Manufacturer
Infineon Technologies
Noise Figure
0.6dB
Mounting Type
Surface Mount
Package / Case
6-XFDFN
Test Frequency
1.575GHz
Current - Supply
4.8mA
Voltage - Supply
1.5V ~ 3.6V
Supplier Device Package
TSLP-6-3
AttributeValue
Gain17dB
P1dB-10dBm
Series-
RF TypeGPS
Frequency1.55GHz ~ 1.615GHz
PackagingTape & Reel (TR)
ManufacturerInfineon Technologies
Noise Figure0.6dB
Mounting TypeSurface Mount
Package / Case6-XFDFN
Test Frequency1.575GHz
Current - Supply4.8mA
Voltage - Supply1.5V ~ 3.6V
Supplier Device PackageTSLP-6-3

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping