Infineon Technologies BGB707L7ESDE6327XTSA1

Infineon Technologies BGB707L7ESDE6327XTSA1 electronic component product image

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Manufacturer No
BGB707L7ESDE6327XTSA1
Quantity
704
Availability
In Stock
Package
6-XFDFN Exposed Pad
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
IC RF AMP 802.11A/B/G/N TSLP7-1
Detailed Description
RF Amplifier IC 802.11a/b/g/n 2.3GHz, 2.7GHz PG-TSLP-7-1
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Gain
27dB
P1dB
8dBm
Series
-
RF Type
802.11a/b/g/n
Frequency
2.3GHz, 2.7GHz
Packaging
Tape & Reel (TR); Cut Tape (CT)
Manufacturer
Infineon Technologies
Noise Figure
0.7dB
Mounting Type
Surface Mount
Package / Case
6-XFDFN Exposed Pad
Test Frequency
1.5GHz
Current - Supply
25mA
Voltage - Supply
1.8V ~ 4V
Base Product Number
BGB707
Supplier Device Package
PG-TSLP-7-1
AttributeValue
Gain27dB
P1dB8dBm
Series-
RF Type802.11a/b/g/n
Frequency2.3GHz, 2.7GHz
PackagingTape & Reel (TR); Cut Tape (CT)
ManufacturerInfineon Technologies
Noise Figure0.7dB
Mounting TypeSurface Mount
Package / Case6-XFDFN Exposed Pad
Test Frequency1.5GHz
Current - Supply25mA
Voltage - Supply1.8V ~ 4V
Base Product NumberBGB707
Supplier Device PackagePG-TSLP-7-1

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping