10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Infineon Technologies BGA736L16E6327XTSA1

Infineon Technologies BGA736L16E6327XTSA1 electronic component product image

Image is only for reference

Manufacturer No
BGA736L16E6327XTSA1
Package
16-XFQFN Exposed Pad
Packaging
Tape & Reel (TR)
Description
IC AMP W-CDMA 800/900MHZ TSLP16
Detailed Description
RF Amplifier IC W-CDMA, HSPDA 800MHz, 900MHz, 1.8GHz, 1.9GHz, 2.1GHz TSLP-16-1
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Gain
16.1dB
P1dB
-11dBm
Series
-
RF Type
W-CDMA, HSPDA
Frequency
800MHz, 900MHz, 1.8GHz, 1.9GHz, 2.1GHz
Packaging
Tape & Reel (TR)
Manufacturer
Infineon Technologies
Noise Figure
7.8dB
Mounting Type
Surface Mount
Package / Case
16-XFQFN Exposed Pad
Test Frequency
1.9GHz
Current - Supply
5.3mA
Voltage - Supply
2.7V ~ 3V
Supplier Device Package
TSLP-16-1
AttributeValue
Gain16.1dB
P1dB-11dBm
Series-
RF TypeW-CDMA, HSPDA
Frequency800MHz, 900MHz, 1.8GHz, 1.9GHz, 2.1GHz
PackagingTape & Reel (TR)
ManufacturerInfineon Technologies
Noise Figure7.8dB
Mounting TypeSurface Mount
Package / Case16-XFQFN Exposed Pad
Test Frequency1.9GHz
Current - Supply5.3mA
Voltage - Supply2.7V ~ 3V
Supplier Device PackageTSLP-16-1

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