Good-Ark Semiconductor GSFK0300

Good-Ark Semiconductor GSFK0300 electronic component product image

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Manufacturer No
GSFK0300
Package
6-TSSOP, SC-88, SOT-363
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
MOSFET 2N-CH 30V 0.8A SOT363
Detailed Description
Mosfet Array 30V 800mA (Tc) 275mW (Tc) Surface Mount SOT-363
Datasheet
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Delivery
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AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
-
Packaging
Tape & Reel (TR); Cut Tape (CT)
Technology
MOSFET (Metal Oxide)
FET Feature
-
Power - Max
275mW (Tc)
Manufacturer
Good-Ark Semiconductor
Configuration
2 N-Channel (Dual)
Mounting Type
Surface Mount
Package / Case
6-TSSOP, SC-88, SOT-363
Vgs(th) (Max) @ Id
1.2V @ 250µA
Operating Temperature
-55°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs
450mOhm @ 300mA, 4.5V
Supplier Device Package
SOT-363
Gate Charge (Qg) (Max) @ Vgs
5.2nC @ 4.5V
Drain to Source Voltage (Vdss)
30V
Input Capacitance (Ciss) (Max) @ Vds
146pF @ 15V
Current - Continuous Drain (Id) @ 25°C
800mA (Tc)
AttributeValue
Series-
PackagingTape & Reel (TR); Cut Tape (CT)
TechnologyMOSFET (Metal Oxide)
FET Feature-
Power - Max275mW (Tc)
ManufacturerGood-Ark Semiconductor
Configuration2 N-Channel (Dual)
Mounting TypeSurface Mount
Package / Case6-TSSOP, SC-88, SOT-363
Vgs(th) (Max) @ Id1.2V @ 250µA
Operating Temperature-55°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs450mOhm @ 300mA, 4.5V
Supplier Device PackageSOT-363
Gate Charge (Qg) (Max) @ Vgs5.2nC @ 4.5V
Drain to Source Voltage (Vdss)30V
Input Capacitance (Ciss) (Max) @ Vds146pF @ 15V
Current - Continuous Drain (Id) @ 25°C800mA (Tc)

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
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