Good-Ark Semiconductor GSFB0305

Good-Ark Semiconductor GSFB0305 electronic component product image

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Manufacturer No
GSFB0305
Package
6-WDFN Exposed Pad
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
MOSFET 2P-CH 30V 4.2A 6PPAK
Detailed Description
Mosfet Array 30V 4.2A (Ta), 8A (Tc) 1.9W (Ta), 7.4W (Tc) Surface Mount 6-PPAK (2x2)
Datasheet
Payment
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Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
-
Packaging
Tape & Reel (TR); Cut Tape (CT)
Technology
MOSFET (Metal Oxide)
FET Feature
-
Power - Max
1.9W (Ta), 7.4W (Tc)
Manufacturer
Good-Ark Semiconductor
Configuration
2 P-Channel (Dual)
Mounting Type
Surface Mount
Package / Case
6-WDFN Exposed Pad
Vgs(th) (Max) @ Id
2.5V @ 250µA
Operating Temperature
-55°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs
75mOhm @ 3A, 10V
Supplier Device Package
6-PPAK (2x2)
Gate Charge (Qg) (Max) @ Vgs
10nC @ 4.5V
Drain to Source Voltage (Vdss)
30V
Input Capacitance (Ciss) (Max) @ Vds
820pF @ 15V
Current - Continuous Drain (Id) @ 25°C
4.2A (Ta), 8A (Tc)
AttributeValue
Series-
PackagingTape & Reel (TR); Cut Tape (CT)
TechnologyMOSFET (Metal Oxide)
FET Feature-
Power - Max1.9W (Ta), 7.4W (Tc)
ManufacturerGood-Ark Semiconductor
Configuration2 P-Channel (Dual)
Mounting TypeSurface Mount
Package / Case6-WDFN Exposed Pad
Vgs(th) (Max) @ Id2.5V @ 250µA
Operating Temperature-55°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs75mOhm @ 3A, 10V
Supplier Device Package6-PPAK (2x2)
Gate Charge (Qg) (Max) @ Vgs10nC @ 4.5V
Drain to Source Voltage (Vdss)30V
Input Capacitance (Ciss) (Max) @ Vds820pF @ 15V
Current - Continuous Drain (Id) @ 25°C4.2A (Ta), 8A (Tc)

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