10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Delta Electronics/Components HCB1380-251L

Delta Electronics/Components HCB1380-251L electronic component product image

Image is only for reference

Manufacturer No
HCB1380-251L
Package
Nonstandard
Packaging
Tape & Reel (TR)
Description
FIXED IND 250NH 68A 0.165 MOHM
Detailed Description
250 nH Unshielded Inductor 68 A 0.165mOhm Nonstandard
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Delta Electronics/Components
Type
-
Series
HCB1380
Ratings
-
Features
-
Q @ Freq
-
Packaging
Tape & Reel (TR)
Shielding
Unshielded
Tolerance
±20%
Inductance
250 nH
Mounting Type
Surface Mount
Package / Case
Nonstandard
Material - Core
-
Size / Dimension
0.524" L x 0.512" W (13.30mm x 13.00mm)
Base Product Number
HCB1380
DC Resistance (DCR)
0.165mOhm
Current Rating (Amps)
68 A
Height - Seated (Max)
0.323" (8.20mm)
Operating Temperature
-40°C ~ 125°C
Supplier Device Package
-
Frequency - Self Resonant
-
Current - Saturation (Isat)
66A
Inductance Frequency - Test
100 kHz
AttributeValue
MfrDelta Electronics/Components
Type-
SeriesHCB1380
Ratings-
Features-
Q @ Freq-
PackagingTape & Reel (TR)
ShieldingUnshielded
Tolerance±20%
Inductance250 nH
Mounting TypeSurface Mount
Package / CaseNonstandard
Material - Core-
Size / Dimension0.524" L x 0.512" W (13.30mm x 13.00mm)
Base Product NumberHCB1380
DC Resistance (DCR)0.165mOhm
Current Rating (Amps)68 A
Height - Seated (Max)0.323" (8.20mm)
Operating Temperature-40°C ~ 125°C
Supplier Device Package-
Frequency - Self Resonant-
Current - Saturation (Isat)66A
Inductance Frequency - Test100 kHz

Purchase & Inquiry

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process