10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

BDE Technology BDE-SG1314R10U32

BDE Technology BDE-SG1314R10U32 electronic component product image

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Manufacturer
Manufacturer No
BDE-SG1314R10U32
Package
39-SMD Module
Packaging
Tape & Reel (TR)
Description
RF TXRX MODULE RF PAD SMD
Detailed Description
802.15.4, General ISM < 1GHz 6LoWPAN, Wireless M-Bus, Wi-SUN, Zigbee® Transceiver Module 868MHz, 915MHz Antenna Not Included, U.FL Surface Mount
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
BDE Technology
Series
-
Protocol
6LoWPAN, Wireless M-Bus, Wi-SUN, Zigbee®
Data Rate
50kbps
Frequency
868MHz, 915MHz
Packaging
Tape & Reel (TR)
Modulation
O-QPSK
Memory Size
256kB RAM
Sensitivity
-121dBm
Antenna Type
Antenna Not Included, U.FL
Mounting Type
Surface Mount
Package / Case
39-SMD Module
Power - Output
14dBm
Voltage - Supply
1.8V ~ 3.8V
Serial Interfaces
ADC, GPIO, I2C, I2S, SPI, UART
RF Family/Standard
802.15.4, General ISM < 1GHz
Utilized IC / Part
CC1314R10
Current - Receiving
-
Operating Temperature
-40°C ~ 85°C
Current - Transmitting
25.8mA
AttributeValue
MfrBDE Technology
Series-
Protocol6LoWPAN, Wireless M-Bus, Wi-SUN, Zigbee®
Data Rate50kbps
Frequency868MHz, 915MHz
PackagingTape & Reel (TR)
ModulationO-QPSK
Memory Size256kB RAM
Sensitivity-121dBm
Antenna TypeAntenna Not Included, U.FL
Mounting TypeSurface Mount
Package / Case39-SMD Module
Power - Output14dBm
Voltage - Supply1.8V ~ 3.8V
Serial InterfacesADC, GPIO, I2C, I2S, SPI, UART
RF Family/Standard802.15.4, General ISM < 1GHz
Utilized IC / PartCC1314R10
Current - Receiving-
Operating Temperature-40°C ~ 85°C
Current - Transmitting25.8mA

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