10-13 NOV 2026 · Munich, Germany

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AMD XCV300E-6FG256C

AMD XCV300E-6FG256C electronic component product image

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Manufacturer
Manufacturer No
XCV300E-6FG256C
Date Code
01+
Quantity
450
Availability
In Stock
Package
256-BGA
Packaging
Tray
Description
IC FPGA 176 I/O 256FBGA
Detailed Description
Virtex®-E Field Programmable Gate Array (FPGA) IC 176 131072 6912 256-BGA
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
AMD
Series
Virtex®-E
Packaging
Tray
Mounting Type
Surface Mount
Number of I/O
176
Package / Case
256-BGA
Total RAM Bits
131072
Number of Gates
411955
Voltage - Supply
1.71V ~ 1.89V
Base Product Number
XCV300E
Number of LABs/CLBs
1536
DigiKey Programmable
Not Verified
Operating Temperature
0°C ~ 85°C (TJ)
Supplier Device Package
256-FBGA (17x17)
Number of Logic Elements/Cells
6912
AttributeValue
MfrAMD
SeriesVirtex®-E
PackagingTray
Mounting TypeSurface Mount
Number of I/O176
Package / Case256-BGA
Total RAM Bits131072
Number of Gates411955
Voltage - Supply1.71V ~ 1.89V
Base Product NumberXCV300E
Number of LABs/CLBs1536
DigiKey ProgrammableNot Verified
Operating Temperature0°C ~ 85°C (TJ)
Supplier Device Package256-FBGA (17x17)
Number of Logic Elements/Cells6912

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