10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

AMD XCV300-4BG352I

AMD XCV300-4BG352I electronic component product image

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Manufacturer
Manufacturer No
XCV300-4BG352I
Date Code
22+
Quantity
323
Availability
In Stock
Package
352-LBGA Exposed Pad, Metal
Packaging
Tray
Description
IC FPGA 260 I/O 352MBGA
Detailed Description
Virtex® Field Programmable Gate Array (FPGA) IC 260 65536 6912 352-LBGA Exposed Pad, Metal
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
AMD
Series
Virtex®
Packaging
Tray
Mounting Type
Surface Mount
Number of I/O
260
Package / Case
352-LBGA Exposed Pad, Metal
Total RAM Bits
65536
Number of Gates
322970
Voltage - Supply
2.375V ~ 2.625V
Base Product Number
XCV300
Number of LABs/CLBs
1536
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 100°C (TJ)
Supplier Device Package
352-MBGA (35x35)
Number of Logic Elements/Cells
6912
AttributeValue
MfrAMD
SeriesVirtex®
PackagingTray
Mounting TypeSurface Mount
Number of I/O260
Package / Case352-LBGA Exposed Pad, Metal
Total RAM Bits65536
Number of Gates322970
Voltage - Supply2.375V ~ 2.625V
Base Product NumberXCV300
Number of LABs/CLBs1536
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 100°C (TJ)
Supplier Device Package352-MBGA (35x35)
Number of Logic Elements/Cells6912

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