AMD XC3S50AN-4TQG144C

AMD XC3S50AN-4TQG144C electronic component product image

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Manufacturer
Manufacturer No
XC3S50AN-4TQG144C
Date Code
21+
Quantity
7,060
Availability
In Stock
Package
144-LQFP
Packaging
Tray
Description
IC FPGA 108 I/O 144TQFP
Detailed Description
Spartan®-3AN Field Programmable Gate Array (FPGA) IC 108 55296 1584 144-LQFP
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
AMD
Series
Spartan®-3AN
Packaging
Tray
Mounting Type
Surface Mount
Number of I/O
108
Package / Case
144-LQFP
Total RAM Bits
55296
Number of Gates
50000
Voltage - Supply
1.14V ~ 1.26V
Base Product Number
XC3S50
Number of LABs/CLBs
176
DigiKey Programmable
Not Verified
Operating Temperature
0°C ~ 85°C (TJ)
Supplier Device Package
144-TQFP (20x20)
Number of Logic Elements/Cells
1584
AttributeValue
MfrAMD
SeriesSpartan®-3AN
PackagingTray
Mounting TypeSurface Mount
Number of I/O108
Package / Case144-LQFP
Total RAM Bits55296
Number of Gates50000
Voltage - Supply1.14V ~ 1.26V
Base Product NumberXC3S50
Number of LABs/CLBs176
DigiKey ProgrammableNot Verified
Operating Temperature0°C ~ 85°C (TJ)
Supplier Device Package144-TQFP (20x20)
Number of Logic Elements/Cells1584

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping