10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

AMD XC3S5000-4FGG900I

AMD XC3S5000-4FGG900I electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
XC3S5000-4FGG900I
Date Code
1245
Quantity
311
Availability
In Stock
Package
900-BBGA
Packaging
Tray
Description
IC FPGA 633 I/O 900FBGA
Detailed Description
Spartan®-3 Field Programmable Gate Array (FPGA) IC 633 1916928 74880 900-BBGA
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
AMD
Series
Spartan®-3
Packaging
Tray
Mounting Type
Surface Mount
Number of I/O
633
Package / Case
900-BBGA
Total RAM Bits
1916928
Number of Gates
5000000
Voltage - Supply
1.14V ~ 1.26V
Base Product Number
XC3S5000
Number of LABs/CLBs
8320
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 100°C (TJ)
Supplier Device Package
900-FBGA (31x31)
Number of Logic Elements/Cells
74880
AttributeValue
MfrAMD
SeriesSpartan®-3
PackagingTray
Mounting TypeSurface Mount
Number of I/O633
Package / Case900-BBGA
Total RAM Bits1916928
Number of Gates5000000
Voltage - Supply1.14V ~ 1.26V
Base Product NumberXC3S5000
Number of LABs/CLBs8320
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 100°C (TJ)
Supplier Device Package900-FBGA (31x31)
Number of Logic Elements/Cells74880

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Packaging Process