AMD XC3S500E-4FGG320C

AMD XC3S500E-4FGG320C electronic component product image

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Manufacturer
Manufacturer No
XC3S500E-4FGG320C
Quantity
84
Availability
In Stock
Package
320-BGA
Packaging
Tray
Description
IC FPGA 232 I/O 320FBGA
Detailed Description
Spartan®-3E Field Programmable Gate Array (FPGA) IC 232 368640 10476 320-BGA
Payment
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Delivery
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AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
AMD
Series
Spartan®-3E
Packaging
Tray
Mounting Type
Surface Mount
Number of I/O
232
Package / Case
320-BGA
Total RAM Bits
368640
Number of Gates
500000
Voltage - Supply
1.14V ~ 1.26V
Base Product Number
XC3S500
Number of LABs/CLBs
1164
DigiKey Programmable
Not Verified
Operating Temperature
0°C ~ 85°C (TJ)
Supplier Device Package
320-FBGA (19x19)
Number of Logic Elements/Cells
10476
AttributeValue
MfrAMD
SeriesSpartan®-3E
PackagingTray
Mounting TypeSurface Mount
Number of I/O232
Package / Case320-BGA
Total RAM Bits368640
Number of Gates500000
Voltage - Supply1.14V ~ 1.26V
Base Product NumberXC3S500
Number of LABs/CLBs1164
DigiKey ProgrammableNot Verified
Operating Temperature0°C ~ 85°C (TJ)
Supplier Device Package320-FBGA (19x19)
Number of Logic Elements/Cells10476

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping