Ambiq Micro, Inc. AMA3B2KK-KBR

Ambiq Micro, Inc. AMA3B2KK-KBR electronic component product image

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Manufacturer
Manufacturer No
AMA3B2KK-KBR
Availability
In Stock
Package
108-BGA
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
MCU 96MHZ M4F 2MB FLSH 108BGA
Detailed Description
ARM® Cortex®-M4F System On Chip (SOC) IC Apollo3 Blue Plus 96MHz 108-BGA (5.3x4.3)
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Speed
96MHz
Series
Apollo3 Blue Plus
RAM Size
768KB
Packaging
Tape & Reel (TR); Cut Tape (CT)
Flash Size
2MB
Peripherals
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Architecture
MCU
Connectivity
GPIO, I2C, SPI, UART/USART, USB OTG
Manufacturer
Ambiq Micro, Inc.
Number of I/O
74
Core Processor
ARM® Cortex®-M4F
Package / Case
108-BGA
Primary Attributes
-
Base Product Number
AMA3B2KK
Operating Temperature
-40°C ~ 85°C
Supplier Device Package
108-BGA (5.3x4.3)
AttributeValue
Speed96MHz
SeriesApollo3 Blue Plus
RAM Size768KB
PackagingTape & Reel (TR); Cut Tape (CT)
Flash Size2MB
PeripheralsBrown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
ArchitectureMCU
ConnectivityGPIO, I2C, SPI, UART/USART, USB OTG
ManufacturerAmbiq Micro, Inc.
Number of I/O74
Core ProcessorARM® Cortex®-M4F
Package / Case108-BGA
Primary Attributes-
Base Product NumberAMA3B2KK
Operating Temperature-40°C ~ 85°C
Supplier Device Package108-BGA (5.3x4.3)

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping