Ambiq Micro, Inc. AMA3B1KK-KCR-TB

Ambiq Micro, Inc. AMA3B1KK-KCR-TB electronic component product image

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Manufacturer
Manufacturer No
AMA3B1KK-KCR-TB
Package
66-UFBGA, CSPBGA
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
MCU 96MHZ M4F 1MB FLSH 66CSP
Detailed Description
ARM® Cortex®-M4F System On Chip (SOC) IC Apollo3 Blue 96MHz 66-CSP (3.38x3.25)
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Speed
96MHz
Series
Apollo3 Blue
RAM Size
384KB
Packaging
Tape & Reel (TR); Cut Tape (CT)
Flash Size
1MB
Peripherals
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Architecture
MCU
Connectivity
I2C, SPI, UART/USART
Manufacturer
Ambiq Micro, Inc.
Number of I/O
37
Core Processor
ARM® Cortex®-M4F
Package / Case
66-UFBGA, CSPBGA
Primary Attributes
-
Base Product Number
AMA3B1KK
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
66-CSP (3.38x3.25)
AttributeValue
Speed96MHz
SeriesApollo3 Blue
RAM Size384KB
PackagingTape & Reel (TR); Cut Tape (CT)
Flash Size1MB
PeripheralsBrown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
ArchitectureMCU
ConnectivityI2C, SPI, UART/USART
ManufacturerAmbiq Micro, Inc.
Number of I/O37
Core ProcessorARM® Cortex®-M4F
Package / Case66-UFBGA, CSPBGA
Primary Attributes-
Base Product NumberAMA3B1KK
Operating Temperature-40°C ~ 85°C (TA)
Supplier Device Package66-CSP (3.38x3.25)

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping