YAGEO XSEMI XP3700M
Image is only for reference
| Attribute | Value |
|---|---|
| HTS | 8541.29.00.55 |
| PPAP | No |
| EU RoHS | Compliant |
| Category | Power MOSFET |
| Material | Si |
| Mounting | Surface Mount |
| Pin Count | 8 |
| Automotive | No |
| PCB changed | 8 |
| Availability | In Stock |
| Channel Mode | Enhancement |
| Channel Type | N|P |
| Configuration | Dual Dual Drain |
| Package Width | 3.9 |
| Package Height | 1.4 |
| Package Length | 5.05 |
| Supplier Package | SO |
| Manufacturer Lead Time | 16 weeks |
| Typical Fall Time (ns) | 4@N Channel|14@P Channel |
| Typical Rise Time (ns) | 7@N Channel|8@P Channel |
| Number of Elements per Chip | 2 |
| Maximum Power Dissipation (mW) | 2000 |
| Typical Gate Charge @ Vgs (nC) | [email protected]@N Channel|[email protected]@P Channel |
| Maximum Gate-Source Voltage (V) | 20 |
| Typical Turn-On Delay Time (ns) | 7@N Channel|9@P Channel |
| Maximum Drain-Source Voltage (V) | 30 |
| Typical Turn-Off Delay Time (ns) | 16@N Channel|28@P Channel |
| Maximum Operating Temperature (°C) | 150 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Continuous Drain Current (A) | 7.8@N Channel|5.5@P Channel |
| Operating Junction Temperature (°C) | -55 to 150 |
| Typical Input Capacitance @ Vds (pF) | 550@15V@N Channel|610@15V@P Channel |
| Maximum Drain-Source Resistance (mOhm) | 20@10V@N Channel|45@10V@P Channel |
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Packaging Process
