Xilinx XC3S200AN-4FTG256C
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| Attribute | Value |
|---|---|
| HTS | 8542.31.00.60 |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Pin Count | 256 |
| Tradename | Spartan |
| User I/Os | 195 |
| Automotive | No |
| Lead Shape | Ball |
| Family Name | Spartan®-3AN |
| PCB changed | 256 |
| Speed Grade | 4 |
| Availability | No Stock Available |
| JTAG Support | Yes |
| Package Width | 17 |
| Logic Elements | 4032 |
| Package Height | 1 |
| Package Length | 17 |
| Copy Protection | Yes |
| I/O Voltage (V) | 1.2|1.5|1.8|2.5|3.3 |
| Programmability | Yes |
| Shift Registers | Utilize LUT |
| Supplier Package | FTBGA |
| Device Logic Gates | 200000 |
| Device Logic Units | 4032 |
| Process Technology | 90nm |
| Device System Gates | 200000 |
| Number of I/O Banks | 4 |
| Program Memory Type | Flash |
| Opr. Frequency (MHz) | 667 |
| Number of Multipliers | 16 (18x18) |
| Standard Package Name | BGA |
| Embedded Memory (Kbit) | 288 |
| Maximum I/O Performance | 622Mbps |
| Number of Global Clocks | 8 |
| Transceiver Speed (Gbps) | 0.622 |
| In-System Programmability | Yes |
| Reprogrammability Support | Yes |
| Device Number of DLLs/PLLs | 4 |
| Differential I/O Standards | LVDS|LVPECL|RSDS |
| Single-Ended I/O Standards | LVTTL|LVCMOS|SSTL|HSTL |
| Supplier Temperature Grade | Commercial |
| Maximum Supply Current (mA) | 70 |
| Maximum Distributed RAM Bits | 28672 |
| Operating Supply Voltage (V) | 1.2 |
| Maximum Differential I/O Pairs | 90 |
| Number of Look-up Table Inputs | 4 |
| Total Number of Block RAM Memories | 16 |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Supply Voltage (V) | 1.26 |
| Minimum Operating Supply Voltage (V) | 1.14 |
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Packaging Process
