10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Würth Elektronik 74477310

Würth Elektronik 74477310 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
74477310
Date Code
22+
Quantity
6,000
Availability
In Stock
Package
Nonstandard
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
FIXED IND 10UH 1.45A 182 MOHM
Detailed Description
10 µH Unshielded Drum Core, Wirewound Inductor 1.45 A 182mOhm Max Nonstandard
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Würth Elektronik
Type
Drum Core, Wirewound
Series
WE-PD2
Ratings
-
Q @ Freq
-
Packaging
Tape & Reel (TR); Cut Tape (CT)
Shielding
Unshielded
Tolerance
±20%
Inductance
10 µH
Mounting Type
Surface Mount
Package / Case
Nonstandard
Material - Core
Ferrite
Size / Dimension
0.177" L x 0.157" W (4.50mm x 4.00mm)
DC Resistance (DCR)
182mOhm Max
Current Rating (Amps)
1.45 A
Height - Seated (Max)
0.138" (3.50mm)
Operating Temperature
-40°C ~ 125°C
Supplier Device Package
-
Frequency - Self Resonant
37MHz
Current - Saturation (Isat)
1.74A
Inductance Frequency - Test
1 kHz
AttributeValue
MfrWürth Elektronik
TypeDrum Core, Wirewound
SeriesWE-PD2
Ratings-
Q @ Freq-
PackagingTape & Reel (TR); Cut Tape (CT)
ShieldingUnshielded
Tolerance±20%
Inductance10 µH
Mounting TypeSurface Mount
Package / CaseNonstandard
Material - CoreFerrite
Size / Dimension0.177" L x 0.157" W (4.50mm x 4.00mm)
DC Resistance (DCR)182mOhm Max
Current Rating (Amps)1.45 A
Height - Seated (Max)0.138" (3.50mm)
Operating Temperature-40°C ~ 125°C
Supplier Device Package-
Frequency - Self Resonant37MHz
Current - Saturation (Isat)1.74A
Inductance Frequency - Test1 kHz

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process