10-13 NOV 2026 · Munich, Germany

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Vishay IRFD9024PBF

Vishay IRFD9024PBF electronic component product image

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Manufacturer
Manufacturer No
IRFD9024PBF
Date Code
25+
Quantity
150
Availability
In Stock
Package
HVMDIP
Packaging
Tube
Description
Trans MOSFET P-CH 60V 1.6A 4-Pin HVMDIP
Detailed Description
Create an effective common drain amplifier using this IRFD9024PBF power MOSFET from Vishay. Its maximum power dissipation is 1300 mW. This MOSFET transistor has a minimum operating temperature of -55 °C and a maximum of 175 °C. This P channel MOSFET transistor operates in enhancement mode.
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8541.29.00.95
PPAP
No
EU RoHS
Compliant
Category
Power MOSFET
Mounting
Through Hole
ECCN (US)
EAR99
Pin Count
4
Automotive
No
Lead Shape
Through Hole
PCB changed
4
Availability
No Stock Available
Channel Mode
Enhancement
Channel Type
P
Configuration
Single Dual Drain
Package Width
6.2
Package Height
3.28
Package Length
4.9
Supplier Package
HVMDIP
Maximum IDSS (uA)
100
Standard Package Name
DIP
Typical Fall Time (ns)
29
Typical Rise Time (ns)
68
Number of Elements per Chip
1
Maximum Power Dissipation (mW)
1300
Typical Gate Charge @ 10V (nC)
19(Max)
Typical Gate Charge @ Vgs (nC)
19(Max)@10V
Maximum Gate-Source Voltage (V)
±20
Typical Output Capacitance (pF)
360
Typical Turn-On Delay Time (ns)
13
Maximum Drain-Source Voltage (V)
60
Typical Gate Plateau Voltage (V)
7.25
Typical Turn-Off Delay Time (ns)
15
Maximum Diode Forward Voltage (V)
6.3
Typical Gate to Drain Charge (nC)
11(Max)
Maximum Gate Threshold Voltage (V)
4
Minimum Gate Threshold Voltage (V)
2
Typical Gate to Source Charge (nC)
5.4(Max)
Typical Reverse Recovery Time (ns)
100
Maximum Operating Temperature (°C)
175
Minimum Operating Temperature (°C)
-55
Maximum Continuous Drain Current (A)
1.6
Operating Junction Temperature (°C)
-55 to 175
Typical Input Capacitance @ Vds (pF)
570@25V
Typical Reverse Recovery Charge (nC)
320
Maximum Drain-Source Resistance (mOhm)
280@10V
Maximum Gate-Source Leakage Current (nA)
100
Maximum Positive Gate-Source Voltage (V)
20
Maximum Pulsed Drain Current @ TC=25°C (A)
13
Typical Reverse Transfer Capacitance @ Vds (pF)
65@25V
AttributeValue
HTS8541.29.00.95
PPAPNo
EU RoHSCompliant
CategoryPower MOSFET
MountingThrough Hole
ECCN (US)EAR99
Pin Count4
AutomotiveNo
Lead ShapeThrough Hole
PCB changed4
AvailabilityNo Stock Available
Channel ModeEnhancement
Channel TypeP
ConfigurationSingle Dual Drain
Package Width6.2
Package Height3.28
Package Length4.9
Supplier PackageHVMDIP
Maximum IDSS (uA)100
Standard Package NameDIP
Typical Fall Time (ns)29
Typical Rise Time (ns)68
Number of Elements per Chip1
Maximum Power Dissipation (mW)1300
Typical Gate Charge @ 10V (nC)19(Max)
Typical Gate Charge @ Vgs (nC)19(Max)@10V
Maximum Gate-Source Voltage (V)±20
Typical Output Capacitance (pF)360
Typical Turn-On Delay Time (ns)13
Maximum Drain-Source Voltage (V)60
Typical Gate Plateau Voltage (V)7.25
Typical Turn-Off Delay Time (ns)15
Maximum Diode Forward Voltage (V)6.3
Typical Gate to Drain Charge (nC)11(Max)
Maximum Gate Threshold Voltage (V)4
Minimum Gate Threshold Voltage (V)2
Typical Gate to Source Charge (nC)5.4(Max)
Typical Reverse Recovery Time (ns)100
Maximum Operating Temperature (°C)175
Minimum Operating Temperature (°C)-55
Maximum Continuous Drain Current (A)1.6
Operating Junction Temperature (°C)-55 to 175
Typical Input Capacitance @ Vds (pF)570@25V
Typical Reverse Recovery Charge (nC)320
Maximum Drain-Source Resistance (mOhm)280@10V
Maximum Gate-Source Leakage Current (nA)100
Maximum Positive Gate-Source Voltage (V)20
Maximum Pulsed Drain Current @ TC=25°C (A)13
Typical Reverse Transfer Capacitance @ Vds (pF)65@25V

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