Touchstone Semiconductor TSM973CUA+T

Touchstone Semiconductor TSM973CUA+T electronic component product image

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Manufacturer No
TSM973CUA+T
Package
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging
Tape & Reel (TR)
Description
IC COMPARATOR 2 W/VOLT REF 8MSOP
Detailed Description
Comparator with Voltage Reference Open-Drain 8-MSOP
Datasheet
Payment
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Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Type
with Voltage Reference
Series
TSM97x
Packaging
Tape & Reel (TR)
Hysteresis
50mV
Output Type
Open-Drain
Manufacturer
Touchstone Semiconductor
Mounting Type
Surface Mount
Package / Case
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
CMRR, PSRR (Typ)
67dB CMRR, 67dB PSRR
Number of Elements
2
Operating Temperature
0°C ~ 70°C
Current - Output (Typ)
40mA
Propagation Delay (Max)
12µs
Supplier Device Package
8-MSOP
Current - Quiescent (Max)
6µA
Current - Input Bias (Max)
0.005µA @ 2.5V
Voltage - Input Offset (Max)
10mV @ 2.5V
Voltage - Supply, Single/Dual (±)
2.5V ~ 11V, ±1.25V ~ 5.5V
AttributeValue
Typewith Voltage Reference
SeriesTSM97x
PackagingTape & Reel (TR)
Hysteresis50mV
Output TypeOpen-Drain
ManufacturerTouchstone Semiconductor
Mounting TypeSurface Mount
Package / Case8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
CMRR, PSRR (Typ)67dB CMRR, 67dB PSRR
Number of Elements2
Operating Temperature0°C ~ 70°C
Current - Output (Typ)40mA
Propagation Delay (Max)12µs
Supplier Device Package8-MSOP
Current - Quiescent (Max)6µA
Current - Input Bias (Max)0.005µA @ 2.5V
Voltage - Input Offset (Max)10mV @ 2.5V
Voltage - Supply, Single/Dual (±)2.5V ~ 11V, ±1.25V ~ 5.5V

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping