TOSHIBA TLP700(TP,F)
Image is only for reference
| Attribute | Value |
|---|---|
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 6 |
| Automotive | No |
| Lead Shape | Gull-wing |
| Output Type | Totem-Pole |
| PCB changed | 6 |
| Availability | No Stock Available |
| Package Width | 6.8 mm |
| Package Height | 3.65 mm |
| Package Length | 4.58 mm |
| Supplier Package | SDIP SMD |
| Standard Package Name | DIP |
| Maximum Fall Time (ns) | 50(Typ) |
| Maximum Rise Time (ns) | 50(Typ) |
| Common Mode Voltage (V) | 1000 |
| Maximum Forward Voltage (V) | 1.75 |
| Maximum Reverse Voltage (V) | 5 |
| Number of Channels per Chip | 1 |
| Maximum Forward Current (mA) | 20 |
| Maximum Power Dissipation (mW) | 700 |
| Maximum Peak Output Current (A) | 2 |
| Minimum Isolation Voltage (Vrms) | 5000 |
| Maximum Operating Temperature (°C) | 100 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Supply Voltage (V) | 30 |
| Minimum Common Mode Rejection (kV/us) | 15 |
| Maximum Propagation Delay Time (tPHL) (ns) | 500 |
| Maximum Propagation Delay Time (tPLH) (ns) | 500 |
Purchase & Inquiry
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Packaging Process
