10-13 NOV 2026 · Munich, Germany

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TOSHIBA MG400Q2YMS3(DAE)

TOSHIBA MG400Q2YMS3(DAE) electronic component product image

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Manufacturer
Manufacturer No
MG400Q2YMS3(DAE)
Description
Trans MOSFET N-CH SiC 1.2KV 400A
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Category
Power MOSFET
Material
SiC
Availability
No Stock Available
Channel Mode
Enhancement
Channel Type
N
Configuration
Dual
Manufacturer Lead Time
32 weeks
Typical Fall Time (ns)
60
Typical Rise Time (ns)
80
Number of Elements per Chip
2
Maximum Power Dissipation (mW)
1350000
Maximum Gate-Source Voltage (V)
25
Typical Turn-On Delay Time (ns)
190
Maximum Drain-Source Voltage (V)
1200
Typical Turn-Off Delay Time (ns)
350
Maximum Operating Temperature (°C)
150
Minimum Operating Temperature (°C)
-40
Maximum Continuous Drain Current (A)
400
Operating Junction Temperature (°C)
150
Typical Input Capacitance @ Vds (pF)
36000@600V
AttributeValue
CategoryPower MOSFET
MaterialSiC
AvailabilityNo Stock Available
Channel ModeEnhancement
Channel TypeN
ConfigurationDual
Manufacturer Lead Time32 weeks
Typical Fall Time (ns)60
Typical Rise Time (ns)80
Number of Elements per Chip2
Maximum Power Dissipation (mW)1350000
Maximum Gate-Source Voltage (V)25
Typical Turn-On Delay Time (ns)190
Maximum Drain-Source Voltage (V)1200
Typical Turn-Off Delay Time (ns)350
Maximum Operating Temperature (°C)150
Minimum Operating Temperature (°C)-40
Maximum Continuous Drain Current (A)400
Operating Junction Temperature (°C)150
Typical Input Capacitance @ Vds (pF)36000@600V

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Packaging Process