Toshiba Semiconductor and Storage TRS30N120HB,S1Q

Images are for reference only

Manufacturer

Toshiba Semiconductor and Storage

Manufacturer No

TRS30N120HB,S1Q

Package

TO-247-3

Packaging

Tube

Description

1200V30A SIC SCHOTTKY BARR DIODE

Detailed Description

Diode Array 1 Pair Common Cathode 1200 V 41A Through Hole TO-247-3

Datasheet

TRS30N120HB,S1Q

Payment

Delivery

Grade

-

Speed

No Recovery Time > 500mA (Io)

Series

-

Packaging

Tube

Technology

SiC (Silicon Carbide) Schottky

Manufacturer

Toshiba Semiconductor and Storage

Mounting Type

Through Hole

Qualification

-

Package / Case

TO-247-3

Diode Configuration

1 Pair Common Cathode

Supplier Device Package

TO-247

Reverse Recovery Time (trr)

0 ns

Current - Reverse Leakage @ Vr

100 µA @ 1200 V

Voltage - DC Reverse (Vr) (Max)

1200 V

Operating Temperature - Junction

175°C

Voltage - Forward (Vf) (Max) @ If

1.45 V @ 15 A

Current - Average Rectified (Io) (per Diode)

41A

Attribute	Value
Grade	-
Speed	No Recovery Time > 500mA (Io)
Series	-
Packaging	Tube
Technology	SiC (Silicon Carbide) Schottky
Manufacturer	Toshiba Semiconductor and Storage
Mounting Type	Through Hole
Qualification	-
Package / Case	TO-247-3
Diode Configuration	1 Pair Common Cathode
Supplier Device Package	TO-247
Reverse Recovery Time (trr)	0 ns
Current - Reverse Leakage @ Vr	100 µA @ 1200 V
Voltage - DC Reverse (Vr) (Max)	1200 V
Operating Temperature - Junction	175°C
Voltage - Forward (Vf) (Max) @ If	1.45 V @ 15 A
Current - Average Rectified (Io) (per Diode)	41A

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Packaging Process