Toshiba Semiconductor and Storage TMP86PM29BUG(C,JZ)

Toshiba Semiconductor and Storage TMP86PM29BUG(C,JZ) electronic component product image

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Manufacturer No
TMP86PM29BUG(C,JZ)
Package
64-LQFP
Packaging
Tray
Description
IC MCU 8BIT 32KB OTP 64LQFP
Detailed Description
TLCS-870/C Microcontroller IC 8-Bit 16MHz 32KB (32K x 8) OTP 64-LQFP (10x10)
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Delivery
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AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Toshiba Semiconductor and Storage
Speed
16MHz
Series
TLCS-870/C
RAM Size
1.5K x 8
Core Size
8-Bit
Packaging
Tray
EEPROM Size
-
Peripherals
LCD, PWM, WDT
Connectivity
SIO, UART/USART
Mounting Type
Surface Mount
Number of I/O
39
Core Processor
-
Package / Case
64-LQFP
Data Converters
A/D 8x10b
Oscillator Type
External
Base Product Number
TMP86
Program Memory Size
32KB (32K x 8)
Program Memory Type
OTP
DigiKey Programmable
Verified
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
64-LQFP (10x10)
Voltage - Supply (Vcc/Vdd)
1.8V ~ 5.5V
AttributeValue
MfrToshiba Semiconductor and Storage
Speed16MHz
SeriesTLCS-870/C
RAM Size1.5K x 8
Core Size8-Bit
PackagingTray
EEPROM Size-
PeripheralsLCD, PWM, WDT
ConnectivitySIO, UART/USART
Mounting TypeSurface Mount
Number of I/O39
Core Processor-
Package / Case64-LQFP
Data ConvertersA/D 8x10b
Oscillator TypeExternal
Base Product NumberTMP86
Program Memory Size32KB (32K x 8)
Program Memory TypeOTP
DigiKey ProgrammableVerified
Operating Temperature-40°C ~ 85°C (TA)
Supplier Device Package64-LQFP (10x10)
Voltage - Supply (Vcc/Vdd)1.8V ~ 5.5V

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
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