Step1: Product
Toshiba Semiconductor and Storage TLP2766F(D4-TP,F)
Images are for reference only
Manufacturer
Manufacturer No
TLP2766F(D4-TP,F)
Quantity
912
Availability
In Stock
Package
6-SOIC (0.268", 6.80mm Width)
Packaging
Bulk
Description
OPTOISOLTR 5KV PUSH PULL 6-SDIP
Detailed Description
Logic Output Optoisolator 20MBd Push-Pull, Totem Pole 5000Vrms 1 Channel 20kV/µs CMTI 6-SDIP Gull Wing
Datasheet
Payment
Delivery
Series
-
Data Rate
20MBd
Packaging
Bulk
Input Type
DC
Output Type
Push-Pull, Totem Pole
Manufacturer
Toshiba Semiconductor and Storage
Mounting Type
Surface Mount
Package / Case
6-SOIC (0.268", 6.80mm Width)
Voltage - Supply
2.7V ~ 5.5V
Number of Channels
1
Voltage - Isolation
5000Vrms
Operating Temperature
-40°C ~ 125°C
Inputs - Side 1/Side 2
1/0
Rise / Fall Time (Typ)
15ns, 15ns
Supplier Device Package
6-SDIP Gull Wing
Current - Output / Channel
10 mA
Voltage - Forward (Vf) (Typ)
1.55V
Current - DC Forward (If) (Max)
25mA
Propagation Delay tpLH / tpHL (Max)
55ns, 55ns
Common Mode Transient Immunity (Min)
20kV/µs
| Attribute | Value |
|---|---|
| Series | - |
| Data Rate | 20MBd |
| Packaging | Bulk |
| Input Type | DC |
| Output Type | Push-Pull, Totem Pole |
| Manufacturer | Toshiba Semiconductor and Storage |
| Mounting Type | Surface Mount |
| Package / Case | 6-SOIC (0.268", 6.80mm Width) |
| Voltage - Supply | 2.7V ~ 5.5V |
| Number of Channels | 1 |
| Voltage - Isolation | 5000Vrms |
| Operating Temperature | -40°C ~ 125°C |
| Inputs - Side 1/Side 2 | 1/0 |
| Rise / Fall Time (Typ) | 15ns, 15ns |
| Supplier Device Package | 6-SDIP Gull Wing |
| Current - Output / Channel | 10 mA |
| Voltage - Forward (Vf) (Typ) | 1.55V |
| Current - DC Forward (If) (Max) | 25mA |
| Propagation Delay tpLH / tpHL (Max) | 55ns, 55ns |
| Common Mode Transient Immunity (Min) | 20kV/µs |
Purchase & Inquiry
Placing an Order
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Payment Options
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Important Notes
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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.
Packaging Process
Step2: Vacuum Packaging
Step3: Anti-Static Bag
Step4: Package Boxes
Step5: Bar-Code Shipping Tags
Step6: Shipping
