Toshiba Semiconductor and Storage TLP170AM(V4TPL,E

Toshiba Semiconductor and Storage TLP170AM(V4TPL,E electronic component product image

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Manufacturer No
TLP170AM(V4TPL,E
Quantity
279
Availability
In Stock
Package
6-SMD, Gull Wing
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
SSR RELAY SPST-NO 700MA 0-60V
Detailed Description
Solid State Photo-Coupled Relay (Photorelay) SPST-NO (1 Form A) 6-SMD, Gull Wing
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Toshiba Semiconductor and Storage
Grade
-
Series
TLP170AM
Circuit
SPST-NO (1 Form A)
Packaging
Tape & Reel (TR); Cut Tape (CT)
Relay Type
Photo-Coupled Relay (Photorelay)
Output Type
AC, DC
Load Current
700 mA
Mounting Type
Surface Mount
Qualification
-
Package / Case
6-SMD, Gull Wing
Voltage - Load
0 V ~ 60 V
Approval Agency
cUL, UL, VDE
Voltage - Input
1.27VDC
Termination Style
Gull Wing
Base Product Number
TLP170
Operating Temperature
-55°C ~ 125°C
Supplier Device Package
6-SMD
On-State Resistance (Max)
300 mOhms
AttributeValue
MfrToshiba Semiconductor and Storage
Grade-
SeriesTLP170AM
CircuitSPST-NO (1 Form A)
PackagingTape & Reel (TR); Cut Tape (CT)
Relay TypePhoto-Coupled Relay (Photorelay)
Output TypeAC, DC
Load Current700 mA
Mounting TypeSurface Mount
Qualification-
Package / Case6-SMD, Gull Wing
Voltage - Load0 V ~ 60 V
Approval AgencycUL, UL, VDE
Voltage - Input1.27VDC
Termination StyleGull Wing
Base Product NumberTLP170
Operating Temperature-55°C ~ 125°C
Supplier Device Package6-SMD
On-State Resistance (Max)300 mOhms

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping