10-13 NOV 2026 · Munich, Germany

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Toshiba Semiconductor and Storage CMS01(TE12L)

Toshiba Semiconductor and Storage CMS01(TE12L) electronic component product image

Image is only for reference

Manufacturer No
CMS01(TE12L)
Package
SOD-128
Packaging
Cut Tape (CT)
Description
DIODE SCHOTTKY 30V 3A MFLAT
Detailed Description
Diode 30 V 3A Surface Mount M-FLAT (2.4x3.8)
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Toshiba Semiconductor and Storage
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Series
-
Packaging
Cut Tape (CT)
Technology
Schottky
Mounting Type
Surface Mount
Package / Case
SOD-128
Base Product Number
CMS01
Capacitance @ Vr, F
-
Supplier Device Package
M-FLAT (2.4x3.8)
Current - Reverse Leakage @ Vr
5 mA @ 30 V
Voltage - DC Reverse (Vr) (Max)
30 V
Current - Average Rectified (Io)
3A
Operating Temperature - Junction
-40°C ~ 125°C
Voltage - Forward (Vf) (Max) @ If
370 mV @ 3 A
AttributeValue
MfrToshiba Semiconductor and Storage
SpeedFast Recovery =< 500ns, > 200mA (Io)
Series-
PackagingCut Tape (CT)
TechnologySchottky
Mounting TypeSurface Mount
Package / CaseSOD-128
Base Product NumberCMS01
Capacitance @ Vr, F-
Supplier Device PackageM-FLAT (2.4x3.8)
Current - Reverse Leakage @ Vr5 mA @ 30 V
Voltage - DC Reverse (Vr) (Max)30 V
Current - Average Rectified (Io)3A
Operating Temperature - Junction-40°C ~ 125°C
Voltage - Forward (Vf) (Max) @ If370 mV @ 3 A

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