Toshiba Semiconductor and Storage 1SS394TE85LF

Toshiba Semiconductor and Storage 1SS394TE85LF electronic component product image

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Manufacturer No
1SS394TE85LF
Package
TO-236-3, SC-59, SOT-23-3
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
DIODE SCHOTTKY 10V 100MA SC59
Detailed Description
Diode 10 V 100mA Surface Mount SC-59
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Toshiba Semiconductor and Storage
Speed
Small Signal =< 200mA (Io), Any Speed
Series
-
Packaging
Tape & Reel (TR); Cut Tape (CT)
Technology
Schottky
Mounting Type
Surface Mount
Package / Case
TO-236-3, SC-59, SOT-23-3
Base Product Number
1SS394
Capacitance @ Vr, F
40pF @ 0V, 1MHz
Supplier Device Package
SC-59
Current - Reverse Leakage @ Vr
20 µA @ 10 V
Voltage - DC Reverse (Vr) (Max)
10 V
Current - Average Rectified (Io)
100mA
Operating Temperature - Junction
125°C (Max)
Voltage - Forward (Vf) (Max) @ If
500 mV @ 100 mA
AttributeValue
MfrToshiba Semiconductor and Storage
SpeedSmall Signal =< 200mA (Io), Any Speed
Series-
PackagingTape & Reel (TR); Cut Tape (CT)
TechnologySchottky
Mounting TypeSurface Mount
Package / CaseTO-236-3, SC-59, SOT-23-3
Base Product Number1SS394
Capacitance @ Vr, F40pF @ 0V, 1MHz
Supplier Device PackageSC-59
Current - Reverse Leakage @ Vr20 µA @ 10 V
Voltage - DC Reverse (Vr) (Max)10 V
Current - Average Rectified (Io)100mA
Operating Temperature - Junction125°C (Max)
Voltage - Forward (Vf) (Max) @ If500 mV @ 100 mA

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping