Texas Instruments TMS370C758BNMT

Texas Instruments TMS370C758BNMT electronic component product image

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Manufacturer
Manufacturer No
TMS370C758BNMT
Package
64-DIP (0.750", 19.05mm)
Packaging
Bulk
Description
IC MCU 8BIT 32KB OTP 64DIP
Detailed Description
TMS370 TMS370 Microcontroller IC 8-Bit 5MHz 32KB (32K x 8) OTP 64-DIP
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Texas Instruments
Speed
5MHz
Series
TMS370
RAM Size
1K x 8
Core Size
8-Bit
Packaging
Bulk
EEPROM Size
256 x 8
Peripherals
PWM, WDT
Connectivity
SCI, SPI
Mounting Type
Through Hole
Number of I/O
44
Core Processor
TMS370
Package / Case
64-DIP (0.750", 19.05mm)
Data Converters
A/D 8x8b
Oscillator Type
Internal
Base Product Number
TMS370C
Program Memory Size
32KB (32K x 8)
Program Memory Type
OTP
DigiKey Programmable
Not Verified
Operating Temperature
-40°C ~ 105°C (TA)
Supplier Device Package
64-DIP
Voltage - Supply (Vcc/Vdd)
4.5V ~ 5.5V
AttributeValue
MfrTexas Instruments
Speed5MHz
SeriesTMS370
RAM Size1K x 8
Core Size8-Bit
PackagingBulk
EEPROM Size256 x 8
PeripheralsPWM, WDT
ConnectivitySCI, SPI
Mounting TypeThrough Hole
Number of I/O44
Core ProcessorTMS370
Package / Case64-DIP (0.750", 19.05mm)
Data ConvertersA/D 8x8b
Oscillator TypeInternal
Base Product NumberTMS370C
Program Memory Size32KB (32K x 8)
Program Memory TypeOTP
DigiKey ProgrammableNot Verified
Operating Temperature-40°C ~ 105°C (TA)
Supplier Device Package64-DIP
Voltage - Supply (Vcc/Vdd)4.5V ~ 5.5V

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping