Texas Instruments TLV9001IDCKR

Texas Instruments TLV9001IDCKR electronic component product image

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Manufacturer
Manufacturer No
TLV9001IDCKR
Date Code
2221
Quantity
290
Availability
In Stock
Package
5-TSSOP, SC-70-5, SOT-353
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
IC CMOS 1 CIRCUIT SC70-5
Detailed Description
CMOS Amplifier 1 Circuit Rail-to-Rail SC-70-5
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Texas Instruments
Series
TLV900x
Packaging
Tape & Reel (TR); Cut Tape (CT)
Slew Rate
2V/µs
Output Type
Rail-to-Rail
Mounting Type
Surface Mount
Amplifier Type
CMOS
Package / Case
5-TSSOP, SC-70-5, SOT-353
Current - Supply
60µA
Number of Circuits
1
Base Product Number
TLV9001
Current - Input Bias
5 pA
Operating Temperature
-40°C ~ 125°C (TA)
Gain Bandwidth Product
1 MHz
Voltage - Input Offset
400 µV
Supplier Device Package
SC-70-5
Current - Output / Channel
40 mA
Voltage - Supply Span (Max)
5.5 V
Voltage - Supply Span (Min)
1.8 V
AttributeValue
MfrTexas Instruments
SeriesTLV900x
PackagingTape & Reel (TR); Cut Tape (CT)
Slew Rate2V/µs
Output TypeRail-to-Rail
Mounting TypeSurface Mount
Amplifier TypeCMOS
Package / Case5-TSSOP, SC-70-5, SOT-353
Current - Supply60µA
Number of Circuits1
Base Product NumberTLV9001
Current - Input Bias5 pA
Operating Temperature-40°C ~ 125°C (TA)
Gain Bandwidth Product1 MHz
Voltage - Input Offset400 µV
Supplier Device PackageSC-70-5
Current - Output / Channel40 mA
Voltage - Supply Span (Max)5.5 V
Voltage - Supply Span (Min)1.8 V

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping