10-13 NOV 2026 · Munich, Germany

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Texas Instruments TLV2764CDR

Texas Instruments TLV2764CDR electronic component product image

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Manufacturer
Manufacturer No
TLV2764CDR
Date Code
25+
Quantity
15,000
Availability
In Stock
Package
14-SOIC (0.154", 3.90mm Width)
Packaging
Tape & Reel (TR)
Description
IC OPAMP GP 4 CIRCUIT 14SOIC
Detailed Description
Standard (General Purpose) Amplifier 4 Circuit Rail-to-Rail 14-SOIC
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Texas Instruments
Series
-
Packaging
Tape & Reel (TR)
Slew Rate
0.23V/µs
Output Type
Rail-to-Rail
Mounting Type
Surface Mount
Amplifier Type
Standard (General Purpose)
Package / Case
14-SOIC (0.154", 3.90mm Width)
Current - Supply
20µA (x4 Channels)
Number of Circuits
4
Base Product Number
TLV2764
Current - Input Bias
3 pA
Operating Temperature
0°C ~ 70°C
Gain Bandwidth Product
500 kHz
Voltage - Input Offset
550 µV
Supplier Device Package
14-SOIC
Current - Output / Channel
10.2 mA
Voltage - Supply Span (Max)
3.6 V
Voltage - Supply Span (Min)
1.8 V
AttributeValue
MfrTexas Instruments
Series-
PackagingTape & Reel (TR)
Slew Rate0.23V/µs
Output TypeRail-to-Rail
Mounting TypeSurface Mount
Amplifier TypeStandard (General Purpose)
Package / Case14-SOIC (0.154", 3.90mm Width)
Current - Supply20µA (x4 Channels)
Number of Circuits4
Base Product NumberTLV2764
Current - Input Bias3 pA
Operating Temperature0°C ~ 70°C
Gain Bandwidth Product500 kHz
Voltage - Input Offset550 µV
Supplier Device Package14-SOIC
Current - Output / Channel10.2 mA
Voltage - Supply Span (Max)3.6 V
Voltage - Supply Span (Min)1.8 V

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Packaging Process