10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Texas Instruments NA556DG4

Texas Instruments NA556DG4 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
NA556DG4
Package
SOIC
Packaging
Tube
Description
Standard Timer Dual 14-Pin SOIC Tube
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
PPAP
No
EU RoHS
Compliant
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Tube
Pin Count
14
Automotive
No
Lead Shape
Gull-wing
PCB changed
14
Availability
No Stock Available
Package Width
3.9
Package Height
1.5(Max)
Package Length
8.65
Supplier Package
SOIC
Output Logic Level
TTL
Standard Package Name
SO
Number of Internal Timers
2
Maximum Quiescent Current (mA)
30
Maximum Operating Temperature (°C)
105
Minimum Operating Temperature (°C)
-40
Maximum Operating Supply Voltage (V)
16
Minimum Operating Supply Voltage (V)
4.5
Typical Operating Supply Voltage (V)
5|9|12|15
Maximum Low Level Output Current (mA)
200
Maximum High Level Output Current (mA)
-200
AttributeValue
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
PackagingTube
Pin Count14
AutomotiveNo
Lead ShapeGull-wing
PCB changed14
AvailabilityNo Stock Available
Package Width3.9
Package Height1.5(Max)
Package Length8.65
Supplier PackageSOIC
Output Logic LevelTTL
Standard Package NameSO
Number of Internal Timers2
Maximum Quiescent Current (mA)30
Maximum Operating Temperature (°C)105
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)16
Minimum Operating Supply Voltage (V)4.5
Typical Operating Supply Voltage (V)5|9|12|15
Maximum Low Level Output Current (mA)200
Maximum High Level Output Current (mA)-200

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process