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Texas Instruments DRA829JMTGBALFR

Texas Instruments DRA829JMTGBALFR electronic component product image

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Manufacturer
Manufacturer No
DRA829JMTGBALFR
Package
827-BFBGA, FCBGA
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
DUAL ARM CORTEX-A72, QUAD CORTEX
Detailed Description
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x System On Chip (SOC) IC - 2GHz, 1GHz, 1.35GHz, 1GHz 827-FCBGA (24x24)
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Speed
2GHz, 1GHz, 1.35GHz, 1GHz
Series
-
RAM Size
1.5MB
Packaging
Tape & Reel (TR); Cut Tape (CT)
Flash Size
-
Peripherals
DMA, PWM, WDT
Architecture
DSP, MCU, MPU
Connectivity
I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB
Manufacturer
Texas Instruments
Number of I/O
226
Core Processor
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Package / Case
827-BFBGA, FCBGA
Primary Attributes
-
Operating Temperature
-40°C ~ 105°C (TJ)
Supplier Device Package
827-FCBGA (24x24)
AttributeValue
Speed2GHz, 1GHz, 1.35GHz, 1GHz
Series-
RAM Size1.5MB
PackagingTape & Reel (TR); Cut Tape (CT)
Flash Size-
PeripheralsDMA, PWM, WDT
ArchitectureDSP, MCU, MPU
ConnectivityI2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB
ManufacturerTexas Instruments
Number of I/O226
Core ProcessorARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Package / Case827-BFBGA, FCBGA
Primary Attributes-
Operating Temperature-40°C ~ 105°C (TJ)
Supplier Device Package827-FCBGA (24x24)

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