10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Texas Instruments CC2510F32RHH

Texas Instruments CC2510F32RHH electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
CC2510F32RHH
Package
VQFN EP
Packaging
Tray
Description
SOC CC2510Fx 8051 36-Pin VQFN EP Tray
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
CAN
0
I2C
0
I2S
1
SPI
1
USB
1
PPAP
No
Type
System-On-Chip
UART
0
USART
2
EU RoHS
Compliant
Ethernet
0
Mounting
Surface Mount
RAM Size
4KB
Packaging
Tray
Pin Count
36
Automotive
No
Lead Shape
No Lead
Device Core
8051
Family Name
CC2510Fx
PCB changed
36
Availability
No Stock Available
Package Width
6.1(Max)
Interface Type
I2S/SPI/USART
Package Height
0.95(Max)
Package Length
6.1(Max)
Processing Unit
Microcontroller
Programmability
Yes
Supplier Package
VQFN EP
Program Memory Size
32KB
Program Memory Type
Flash
Standard Package Name
QFN
Maximum Clock Frequency (MHz)
2483.5
Maximum Operating Temperature (°C)
85
Minimum Operating Temperature (°C)
-40
AttributeValue
CAN0
I2C0
I2S1
SPI1
USB1
PPAPNo
TypeSystem-On-Chip
UART0
USART2
EU RoHSCompliant
Ethernet0
MountingSurface Mount
RAM Size4KB
PackagingTray
Pin Count36
AutomotiveNo
Lead ShapeNo Lead
Device Core8051
Family NameCC2510Fx
PCB changed36
AvailabilityNo Stock Available
Package Width6.1(Max)
Interface TypeI2S/SPI/USART
Package Height0.95(Max)
Package Length6.1(Max)
Processing UnitMicrocontroller
ProgrammabilityYes
Supplier PackageVQFN EP
Program Memory Size32KB
Program Memory TypeFlash
Standard Package NameQFN
Maximum Clock Frequency (MHz)2483.5
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process