10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

TE Connectivity 2295782-1

TE Connectivity 2295782-1 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
2295782-1
Description
Conn Micro SD/Nano SIM Combo Connector RCP 20 POS 1.1mm/2.54mm Solder RA SMD 0.3A/Contact
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
PPAP
No
SVHC
Yes
Type
Micro SD/Nano SIM Combo Connector
Gender
RCP
EU RoHS
Compliant
Mounting
Surface Mount
ECCN (US)
EAR99
Automotive
No
Availability
In Stock
Body Orientation
Right Angle
Terminal Plating
Gold Over Nickel
Number of Contacts
20
Product Depth (mm)
28.25
Termination Method
Solder
Product Height (mm)
1.32
Terminal Pitch (mm)
1.1/2.54
Mating Cycle (Cycles)
2000
Maximum Current Rating (A)
0.3/Contact
Insulation Resistance (MOhm)
1000
Maximum Contact Resistance (mOhm)
100
Maximum Operating Temperature (°C)
85
Minimum Operating Temperature (°C)
-40
AttributeValue
PPAPNo
SVHCYes
TypeMicro SD/Nano SIM Combo Connector
GenderRCP
EU RoHSCompliant
MountingSurface Mount
ECCN (US)EAR99
AutomotiveNo
AvailabilityIn Stock
Body OrientationRight Angle
Terminal PlatingGold Over Nickel
Number of Contacts20
Product Depth (mm)28.25
Termination MethodSolder
Product Height (mm)1.32
Terminal Pitch (mm)1.1/2.54
Mating Cycle (Cycles)2000
Maximum Current Rating (A)0.3/Contact
Insulation Resistance (MOhm)1000
Maximum Contact Resistance (mOhm)100
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process