TE Connectivity 1393788-3
Image is only for reference
| Attribute | Value |
|---|---|
| HTS | 8536.41.00.50 |
| PPAP | Unknown |
| SVHC | Yes |
| Seal | Wash Tight |
| EU RoHS | Compliant |
| Mounting | Through Hole |
| ECCN (US) | EAR99 |
| IP Rating | IP67 |
| Automotive | Yes |
| Availability | In Stock |
| Contact Form | 2 Form C |
| Package Type | DIP |
| Contact Material | Silver Nickel/Gold |
| Coil Current (mA) | 28.09 |
| Operate Time (ms) | 4 |
| Release Time (ms) | 4 |
| Termination Style | PC Pin |
| Product Depth (mm) | 7.2 |
| Product Weight (g) | 2.8 |
| Relay Construction | Non-Latching |
| Contact Arrangement | DPDT |
| DC Coil Voltage (V) | 5 |
| Number of Terminals | 8 |
| Product Height (mm) | 9.8 |
| Product Length (mm) | 14.5 |
| Coil Resistance (Ohm) | 178 |
| Manufacturer Lead Time | 40 weeks |
| Maximum Pick-Up Voltage | 3.75VDC |
| Maximum Switching Power | 60W|62.5VA |
| Minimum Dropout Voltage | 0.5VDC |
| Electrical Life (Operations) | 50000000 |
| Insulation Resistance (MOhm) | >1000 |
| Mechanical Life (Operations) | 100000000 |
| Maximum Switching Current (A) | 2 |
| Maximum AC Switching Voltage (V) | 250 |
| Maximum DC Switching Voltage (V) | 220 |
| Maximum Contact Resistance (mOhm) | <50 |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | -40 |
Purchase & Inquiry
You can place an order with FIXCHIPS without having to register or create an account.
To make payment more convenient, we support multiple payment methods in USD, including PayPal, credit cards, and wire transfer.
We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.
1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.
2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.
Packaging Process
