10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

TE Connectivity 1058083-1

TE Connectivity 1058083-1 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
1058083-1
Availability
In Stock
Description
Conn SMA-BNC Adapter 0Hz to 4GHz 50Ohm ST Panel Mount PL/RCP Gold
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8536.69.40.10
PPAP
No
SVHC
Yes
Type
SMA-BNC Adapter
Gender
PL/RCP
EU RoHS
Compliant with Exemption
Mounting
Panel Mount
Polarity
Standard
ECCN (US)
EAR99
Automotive
No
Availability
No Stock Available
Mating System
Bayonet Lock/Threaded
Contact Gender
PIN/SKT
Contact Plating
Gold
Impedance (Ohm)
50
Body Orientation
Straight
Product Depth (mm)
12.7
Product Length (mm)
34.6
Product Diameter (mm)
14.3
Manufacturer Lead Time
10 weeks
SVHC Exceeds Threshold
Yes
Operating Frequency (Hz)
0 to 4G
Maximum Insertion Loss (dB)
0.4
Insulation Resistance (MOhm)
5000
Maximum Operating Temperature (°C)
125
Minimum Operating Temperature (°C)
-65
AttributeValue
HTS8536.69.40.10
PPAPNo
SVHCYes
TypeSMA-BNC Adapter
GenderPL/RCP
EU RoHSCompliant with Exemption
MountingPanel Mount
PolarityStandard
ECCN (US)EAR99
AutomotiveNo
AvailabilityNo Stock Available
Mating SystemBayonet Lock/Threaded
Contact GenderPIN/SKT
Contact PlatingGold
Impedance (Ohm)50
Body OrientationStraight
Product Depth (mm)12.7
Product Length (mm)34.6
Product Diameter (mm)14.3
Manufacturer Lead Time10 weeks
SVHC Exceeds ThresholdYes
Operating Frequency (Hz)0 to 4G
Maximum Insertion Loss (dB)0.4
Insulation Resistance (MOhm)5000
Maximum Operating Temperature (°C)125
Minimum Operating Temperature (°C)-65

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process