10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

TE Connectivity Passive Product SP110RFT

TE Connectivity Passive Product SP110RFT electronic component product image

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Manufacturer No
SP110RFT
Package
2615 J-Lead
Packaging
Tape & Reel (TR)
Description
RES SMD 10 OHM 1% 1.5W 2615
Detailed Description
10 Ohms ±1% 1.5W Chip Resistor 2615 J-Lead Current Sense, Moisture Resistant Wirewound
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
TE Connectivity Passive Product
Series
SP, CGS
Features
Current Sense, Moisture Resistant
Packaging
Tape & Reel (TR)
Tolerance
±1%
Resistance
10 Ohms
Composition
Wirewound
Failure Rate
-
Power (Watts)
1.5W
Package / Case
2615 J-Lead
Size / Dimension
0.255" L x 0.150" W (6.48mm x 3.81mm)
Base Product Number
SP1
Height - Seated (Max)
0.112" (2.84mm)
Operating Temperature
-
Number of Terminations
2
Supplier Device Package
SMD
Temperature Coefficient
±50ppm/°C
AttributeValue
MfrTE Connectivity Passive Product
SeriesSP, CGS
FeaturesCurrent Sense, Moisture Resistant
PackagingTape & Reel (TR)
Tolerance±1%
Resistance10 Ohms
CompositionWirewound
Failure Rate-
Power (Watts)1.5W
Package / Case2615 J-Lead
Size / Dimension0.255" L x 0.150" W (6.48mm x 3.81mm)
Base Product NumberSP1
Height - Seated (Max)0.112" (2.84mm)
Operating Temperature-
Number of Terminations2
Supplier Device PackageSMD
Temperature Coefficient±50ppm/°C

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process