10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

TDK B82625B2302M001

TDK B82625B2302M001 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
B82625B2302M001
Availability
In Stock
Package
Horizontal, 4 PC Pin
Packaging
Tray
Description
CMC 700UH 3A 2LN TH PFC
Detailed Description
700 µH @ 100 kHz 2 Line Common Mode Choke Through Hole 3A DCR 210mOhm (Typ)
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
B82625
Ratings
-
Features
PFC
Packaging
Tray
Filter Type
Power Line
Height (Max)
1.181" (30.00mm)
Manufacturer
TDK
Mounting Type
Through Hole
Package / Case
Horizontal, 4 PC Pin
Approval Agency
ENEC, VDE
Number of Lines
2
Size / Dimension
1.732" L x 1.669" W (44.00mm x 42.40mm)
Voltage Rating - AC
250V
Voltage Rating - DC
350V
Current Rating (Max)
3A
Operating Temperature
-40°C ~ 125°C
Inductance @ Frequency
700 µH @ 100 kHz
DC Resistance (DCR) (Max)
210mOhm (Typ)
AttributeValue
SeriesB82625
Ratings-
FeaturesPFC
PackagingTray
Filter TypePower Line
Height (Max)1.181" (30.00mm)
ManufacturerTDK
Mounting TypeThrough Hole
Package / CaseHorizontal, 4 PC Pin
Approval AgencyENEC, VDE
Number of Lines2
Size / Dimension1.732" L x 1.669" W (44.00mm x 42.40mm)
Voltage Rating - AC250V
Voltage Rating - DC350V
Current Rating (Max)3A
Operating Temperature-40°C ~ 125°C
Inductance @ Frequency700 µH @ 100 kHz
DC Resistance (DCR) (Max)210mOhm (Typ)

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Packaging Process