10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

TDK B82111E0000C024

TDK B82111E0000C024 electronic component product image

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Manufacturer
Manufacturer No
B82111E0000C024
Date Code
23+
Quantity
500
Availability
In Stock
Package
Axial
Packaging
Tape & Reel (TR)
Description
FIXED IND 56UH 1.5A 300 MOHM TH
Detailed Description
56 µH Unshielded Drum Core, Wirewound Inductor 1.5 A 300mOhm Axial
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
TDK
Type
Drum Core, Wirewound
Series
B82111E
Ratings
-
Q @ Freq
-
Packaging
Tape & Reel (TR)
Shielding
Unshielded
Tolerance
±20%
Inductance
56 µH
Mounting Type
Through Hole
Package / Case
Axial
Material - Core
Ferrite
Size / Dimension
0.256" Dia x 1.024" L (6.50mm x 26.00mm)
DC Resistance (DCR)
300mOhm
Current Rating (Amps)
1.5 A
Height - Seated (Max)
-
Operating Temperature
-55°C ~ 125°C
Supplier Device Package
-
Frequency - Self Resonant
70MHz
Current - Saturation (Isat)
-
Inductance Frequency - Test
100 kHz
AttributeValue
MfrTDK
TypeDrum Core, Wirewound
SeriesB82111E
Ratings-
Q @ Freq-
PackagingTape & Reel (TR)
ShieldingUnshielded
Tolerance±20%
Inductance56 µH
Mounting TypeThrough Hole
Package / CaseAxial
Material - CoreFerrite
Size / Dimension0.256" Dia x 1.024" L (6.50mm x 26.00mm)
DC Resistance (DCR)300mOhm
Current Rating (Amps)1.5 A
Height - Seated (Max)-
Operating Temperature-55°C ~ 125°C
Supplier Device Package-
Frequency - Self Resonant70MHz
Current - Saturation (Isat)-
Inductance Frequency - Test100 kHz

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Packaging Process