10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

TDK B57164K0330J052

TDK B57164K0330J052 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
B57164K0330J052
Availability
In Stock
Package
Disc, 5.5mm Dia x 5.0mm W
Packaging
Tape & Box (TB)
Description
THERMISTOR NTC 33OHM 2900K DISC
Detailed Description
NTC Thermistor 33 Disc, 5.5mm Dia x 5.0mm W
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
B0/50
-
B25/50
-
B25/75
-
B25/85
-
Series
-
B25/100
2900K
Packaging
Tape & Box (TB)
Power - Max
450 mW
Manufacturer
TDK
Mounting Type
Through Hole
Package / Case
Disc, 5.5mm Dia x 5.0mm W
B Value Tolerance
±3%
Length - Lead Wire
-
Resistance Tolerance
±5%
Operating Temperature
-55°C ~ 125°C
Resistance in Ohms @ 25°C
33
AttributeValue
B0/50-
B25/50-
B25/75-
B25/85-
Series-
B25/1002900K
PackagingTape & Box (TB)
Power - Max450 mW
ManufacturerTDK
Mounting TypeThrough Hole
Package / CaseDisc, 5.5mm Dia x 5.0mm W
B Value Tolerance±3%
Length - Lead Wire-
Resistance Tolerance±5%
Operating Temperature-55°C ~ 125°C
Resistance in Ohms @ 25°C33

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Packaging Process