10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

TDK B43640E2188M 62

TDK B43640E2188M 62 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
B43640E2188M 62
Packaging
Cardboard
Description
Cap Aluminum Lytic 1800uF 250V 20% (35 X 45mm) Snap-In 0.06 Ohm 3.01A 2000h 105°C Cardboard
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
PPAP
No
Type
Electrolytic
EU RoHS
Compliant
IL (uA)
2722.75@5Min
IR (mA)
3.01
Voltage
250VDC
Mounting
Through Hole
Polarity
Polar
ECCN (US)
EAR99
ESR (Ohm)
0.06
Packaging
Cardboard
Size (mm)
35 X 45
Tolerance
20%
Automotive
No
Availability
No Stock Available
Construction
Aluminum Cylindrical Can
Lifetime (h)
2000
Capacitance Value
1800uF
Termination Style
Snap-In
Lead Diameter (mm)
0.8
Product Weight (g)
56
Number of Terminals
3
Product Height (mm)
45
Product Diameter (mm)
35
Maximum Impedance (Ohm)
0.09@20°C@10kHz
Equivalent Series Resistance Type
Low
Maximum Operating Temperature (°C)
105
Minimum Operating Temperature (°C)
-40
AttributeValue
PPAPNo
TypeElectrolytic
EU RoHSCompliant
IL (uA)2722.75@5Min
IR (mA)3.01
Voltage250VDC
MountingThrough Hole
PolarityPolar
ECCN (US)EAR99
ESR (Ohm)0.06
PackagingCardboard
Size (mm)35 X 45
Tolerance20%
AutomotiveNo
AvailabilityNo Stock Available
ConstructionAluminum Cylindrical Can
Lifetime (h)2000
Capacitance Value1800uF
Termination StyleSnap-In
Lead Diameter (mm)0.8
Product Weight (g)56
Number of Terminals3
Product Height (mm)45
Product Diameter (mm)35
Maximum Impedance (Ohm)0.09@20°C@10kHz
Equivalent Series Resistance TypeLow
Maximum Operating Temperature (°C)105
Minimum Operating Temperature (°C)-40

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process