10-13 NOV 2026 · Munich, Germany

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TDK InvenSense EV_MOD_CH201-00-01

TDK InvenSense EV_MOD_CH201-00-01 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
EV_MOD_CH201-00-01
Availability
In Stock
Packaging
Tray
Description
CHIRP EVAL BRD FOR CH201
Detailed Description
CH-201 - Ultrasonic, 3D Time-of-Flight (ToF) Sensor Evaluation Board
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Note
-
Series
-
Contents
Board(s)
Embedded
-
Interface
I2C
Packaging
Tray
Sensitivity
-
Sensor Type
Ultrasonic, 3D Time-of-Flight (ToF)
Manufacturer
TDK InvenSense
Sensing Range
-
Voltage - Supply
1.8V
Utilized IC / Part
CH-201
Base Product Number
MOD_CH201
AttributeValue
Note-
Series-
ContentsBoard(s)
Embedded-
InterfaceI2C
PackagingTray
Sensitivity-
Sensor TypeUltrasonic, 3D Time-of-Flight (ToF)
ManufacturerTDK InvenSense
Sensing Range-
Voltage - Supply1.8V
Utilized IC / PartCH-201
Base Product NumberMOD_CH201

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Packaging Process