10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

t-Global Technology DC0021/01-TI900-0.12-2A

t-Global Technology DC0021/01-TI900-0.12-2A electronic component product image

Image is only for reference

Manufacturer No
DC0021/01-TI900-0.12-2A
Packaging
Bulk
Description
THERM PAD 104.1MMX73.7MM W/ADH
Detailed Description
Thermal Pad White 104.10mm x 73.70mm Rectangular Adhesive - Both Sides
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Type
Die-Cut Pad, Sheet
Color
White
Shape
Rectangular
Usage
Power Module
Series
Ti900
Outline
104.10mm x 73.70mm
Adhesive
Adhesive - Both Sides
Material
Silicone
Packaging
Bulk
Thickness
0.0050" (0.127mm)
Shelf Life
24 Months
Manufacturer
t-Global Technology
Backing, Carrier
Viscose
Shelf Life Start
-
Base Product Number
DC0021/01
Thermal Resistivity
-
Thermal Conductivity
1.8W/m-K
Storage/Refrigeration Temperature
-
AttributeValue
TypeDie-Cut Pad, Sheet
ColorWhite
ShapeRectangular
UsagePower Module
SeriesTi900
Outline104.10mm x 73.70mm
AdhesiveAdhesive - Both Sides
MaterialSilicone
PackagingBulk
Thickness0.0050" (0.127mm)
Shelf Life24 Months
Manufacturert-Global Technology
Backing, CarrierViscose
Shelf Life Start-
Base Product NumberDC0021/01
Thermal Resistivity-
Thermal Conductivity1.8W/m-K
Storage/Refrigeration Temperature-

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Packaging Process