10-13 NOV 2026 · Munich, Germany

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STMicroelectronics TS1872IN

STMicroelectronics TS1872IN electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
TS1872IN
Date Code
0944
Quantity
1,650
Availability
In Stock
Package
8-DIP (0.300", 7.62mm)
Packaging
Tube
Description
IC OPAMP GP 2 CIRCUIT 8MINI DIP
Detailed Description
Standard (General Purpose) Amplifier 2 Circuit Rail-to-Rail 8-Mini DIP
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
STMicroelectronics
Series
-
Packaging
Tube
Slew Rate
0.6V/µs
Output Type
Rail-to-Rail
Mounting Type
Through Hole
Amplifier Type
Standard (General Purpose)
Package / Case
8-DIP (0.300", 7.62mm)
Current - Supply
500µA (x2 Channels)
Number of Circuits
2
Base Product Number
TS1872
Current - Input Bias
70 nA
Operating Temperature
-40°C ~ 125°C
Gain Bandwidth Product
1.8 MHz
Voltage - Input Offset
3 mV
Supplier Device Package
8-Mini DIP
Current - Output / Channel
80 mA
Voltage - Supply Span (Max)
6 V
Voltage - Supply Span (Min)
1.8 V
AttributeValue
MfrSTMicroelectronics
Series-
PackagingTube
Slew Rate0.6V/µs
Output TypeRail-to-Rail
Mounting TypeThrough Hole
Amplifier TypeStandard (General Purpose)
Package / Case8-DIP (0.300", 7.62mm)
Current - Supply500µA (x2 Channels)
Number of Circuits2
Base Product NumberTS1872
Current - Input Bias70 nA
Operating Temperature-40°C ~ 125°C
Gain Bandwidth Product1.8 MHz
Voltage - Input Offset3 mV
Supplier Device Package8-Mini DIP
Current - Output / Channel80 mA
Voltage - Supply Span (Max)6 V
Voltage - Supply Span (Min)1.8 V

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Packaging Process