STMicroelectronics TESEO-LIV3R

STMicroelectronics TESEO-LIV3R electronic component product image

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Manufacturer
Manufacturer No
TESEO-LIV3R
Quantity
7
Availability
In Stock
Package
18-SMD Module
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
GPS MODULE
Detailed Description
- RF Receiver BeiDou, GLONASS, GNSS, GPS 1.561GHz, 1.575MHz -163dBm Not Included 18-LCC (9.7x10.1)
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
-
Features
-
Frequency
1.561GHz, 1.575MHz
Packaging
Tape & Reel (TR); Cut Tape (CT)
Memory Size
-
Sensitivity
-163dBm
Applications
General Purpose
Manufacturer
STMicroelectronics
Mounting Type
Surface Mount
Data Interface
I2C, UART
Package / Case
18-SMD Module
Data Rate (Max)
-
Voltage - Supply
2.1V ~ 4.3V
Antenna Connector
Not Included
Base Product Number
TESEO
Current - Receiving
-
Operating Temperature
-40°C ~ 85°C (TA)
Modulation or Protocol
BeiDou, GLONASS, GNSS, GPS
Supplier Device Package
18-LCC (9.7x10.1)
AttributeValue
Series-
Features-
Frequency1.561GHz, 1.575MHz
PackagingTape & Reel (TR); Cut Tape (CT)
Memory Size-
Sensitivity-163dBm
ApplicationsGeneral Purpose
ManufacturerSTMicroelectronics
Mounting TypeSurface Mount
Data InterfaceI2C, UART
Package / Case18-SMD Module
Data Rate (Max)-
Voltage - Supply2.1V ~ 4.3V
Antenna ConnectorNot Included
Base Product NumberTESEO
Current - Receiving-
Operating Temperature-40°C ~ 85°C (TA)
Modulation or ProtocolBeiDou, GLONASS, GNSS, GPS
Supplier Device Package18-LCC (9.7x10.1)

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping