10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

STMicroelectronics STPS120MF

STMicroelectronics STPS120MF electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
STPS120MF
Date Code
24+
Quantity
20,000
Availability
In Stock
Package
DO-222AA
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
DIODE SCHOTTK 20V 1A STMITE FLAT
Detailed Description
Diode 20 V 1A Surface Mount STmite Flat
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
STMicroelectronics
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Series
-
Packaging
Tape & Reel (TR); Cut Tape (CT)
Technology
Schottky
Mounting Type
Surface Mount
Package / Case
DO-222AA
Base Product Number
STPS120
Capacitance @ Vr, F
-
Supplier Device Package
STmite Flat
Current - Reverse Leakage @ Vr
3.9 µA @ 20 V
Voltage - DC Reverse (Vr) (Max)
20 V
Current - Average Rectified (Io)
1A
Operating Temperature - Junction
150°C (Max)
Voltage - Forward (Vf) (Max) @ If
490 mV @ 1 A
AttributeValue
MfrSTMicroelectronics
SpeedFast Recovery =< 500ns, > 200mA (Io)
Series-
PackagingTape & Reel (TR); Cut Tape (CT)
TechnologySchottky
Mounting TypeSurface Mount
Package / CaseDO-222AA
Base Product NumberSTPS120
Capacitance @ Vr, F-
Supplier Device PackageSTmite Flat
Current - Reverse Leakage @ Vr3.9 µA @ 20 V
Voltage - DC Reverse (Vr) (Max)20 V
Current - Average Rectified (Io)1A
Operating Temperature - Junction150°C (Max)
Voltage - Forward (Vf) (Max) @ If490 mV @ 1 A

Purchase & Inquiry

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RFQ (Request for Quote)

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Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process