10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

STMicroelectronics STGSH80HB65DAG

STMicroelectronics STGSH80HB65DAG electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
STGSH80HB65DAG
Quantity
3
Availability
In Stock
Package
9-PowerSMD
Packaging
Bulk
Description
IGBT MOD 650V 83A 9-ACEPACK SMIT
Detailed Description
IGBT Module Half Bridge 650 V 83 A 250 W Surface Mount 9-ACEPACK SMIT
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Input
Standard
Series
HB
IGBT Type
-
Packaging
Bulk
Power - Max
250 W
Manufacturer
STMicroelectronics
Configuration
Half Bridge
Mounting Type
Surface Mount
NTC Thermistor
No
Package / Case
9-PowerSMD
Operating Temperature
-55°C ~ 175°C (TJ)
Supplier Device Package
9-ACEPACK SMIT
Vce(on) (Max) @ Vge, Ic
2.1V @ 15V, 80A
Current - Collector (Ic) (Max)
83 A
Input Capacitance (Cies) @ Vce
10450 pF @ 25 V
Voltage - Collector Emitter Breakdown (Max)
650 V
AttributeValue
InputStandard
SeriesHB
IGBT Type-
PackagingBulk
Power - Max250 W
ManufacturerSTMicroelectronics
ConfigurationHalf Bridge
Mounting TypeSurface Mount
NTC ThermistorNo
Package / Case9-PowerSMD
Operating Temperature-55°C ~ 175°C (TJ)
Supplier Device Package9-ACEPACK SMIT
Vce(on) (Max) @ Vge, Ic2.1V @ 15V, 80A
Current - Collector (Ic) (Max)83 A
Input Capacitance (Cies) @ Vce10450 pF @ 25 V
Voltage - Collector Emitter Breakdown (Max)650 V

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Packaging Process